Stress & Load Development
We combine classical hand calculations with high-fidelity Finite Element Analysis (FEA) to map stress profiles and dynamic loads. Our assessments accurately trace load paths through complex assemblies under extreme operational environments. We evaluate fatigue life, conduct fracture mechanics to predict crack propagation, and perform composite layer optimization to maximize strength-to-weight ratios.
Dynamic & High-Frequency Analysis
We isolate and evaluate how structures react to time-dependent and rapidly changing operational forces. Our team maps structural dynamics to prevent catastrophic resonant frequencies under severe excitation. We run high-frequency harmonic and modal analyses to predict physical responses across wide operating spectrums.
Crash Simulation & Transient Physics
Our engineers model non-linear material behaviors during high-energy impacts and transient loading events. We evaluate crash worthiness, energy absorption mechanics, and high-velocity drop scenarios for specialized hardware. These predictive models eliminate the need for costly iterative physical destructive testing cycles.
Shock Analysis
We subject digital twins to rigorous random vibration, sinusoidal sweeps, and shock profiles. This modeling ensures that critical hardware survives extreme vehicle launch, transportation, and mechanical deployment sequences. Our simulations isolate peak g-forces and displacement margins to safeguard delicate internal mechanisms.
Electronic Box Analysis
We safeguard sensitive electronics by performing coupled thermal-structural and dynamic evaluations. Our models track board-level deflection, solder joint fatigue, and component-level structural stresses. This ensures ruggedized electronic enclosures preserve signal integrity in harsh military, aerospace, and industrial settings.